LENOVO 3837H6G - Lenovo System x3850 X6: Workload Optimized Solution for SAP HANA
Rack mounting : Yes
Rack rails : Yes
PCI Express slots version : 3.0
ECC : Yes
Internal memory : 1.02 TB
Internal memory type : DDR3-SDRAM
Maximum internal memory : 6.14 TB
Memory clock speed : 1600 MHz
Memory layout (slots x size) : 32 x 32 GB
Memory slots : 96
Ethernet LAN : Yes
Intel® Virtualization Technology (Intel® VT) : VT-d, VT-x
Cables included : AC
Serial ports quantity : 1
USB 2.0 ports quantity : 5
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity : 2
VGA (D-Sub) ports quantity : 2
Number of main power supplies : 4
Number of redundant power supplies installed : 4
Number of redundant power supplies supported : 4
Power supply : 1400 W
Redundant power supply (RPS) support : Yes
Bus type : QPI
Conflict-Free processor : Yes
ECC supported by processor : Yes
Embedded options available : No
Execute Disable Bit : Yes
FSB Parity : No
Idle States : Yes
Maximum internal memory supported by processor : 1.54 TB
Maximum number of PCI Express lanes : 32
Memory bandwidth supported by processor (max) : 85 GB/s
Memory channels supported by processor : Quad
Memory clock speeds supported by processor : 1066,1333,1600 MHz
Memory types supported by processor : DDR3-SDRAM
Number of QPI links : 3
Number of processors installed : 4
PCI Express configurations : x4, x8, x16
Physical Address Extension (PAE) : Yes
Physical Address Extension (PAE) : 46 bit
Processor boost frequency : 3.1 GHz
Processor cache : 37.5 MB
Processor cache type : L3
Processor code : SR1GH
Processor codename : Ivy Bridge
Processor cores : 15
Processor family : Intel® Xeon® E7 V2 Family
Processor frequency : 2.5 GHz
Processor lithography : 22 nm
Processor manufacturer : Intel
Processor model : E7-8880V2
Processor operating modes : 64-bit
Processor package size : 52 x 45 mm
Processor series : Intel Xeon E7-8800 v2
Processor socket : LGA 2011 (Socket R)
Processor threads : 30
Scalability : S8S
Stepping : D1
Supported instruction sets : AVX
Supported processor sockets : LGA 2011 (Socket R)
System bus rate : 8 GT/s
Tcase : 73 °C
Thermal Design Power (TDP) : 130 W
Thermal Monitoring Technologies : Yes
CPU configuration (max) : 8
Enhanced Intel SpeedStep Technology : Yes
Intel 64 : Yes
Intel Clear Video Technology : No
Intel Demand Based Switching : No
Intel Dual Display Capable Technology : No
Intel Enhanced Halt State : Yes
Intel FDI Technology : No
Intel Fast Memory Access : No
Intel Flex Memory Access : No
Intel Instruction Replay Technology : No
Intel Instruction Replay Technology version : 0.00
Intel Rapid Storage Technology : No
Intel Secure Key Technology version : 1.00
Intel TSX-NI : No
Intel TSX-NI version : 0.00
Intel Trusted Execution Technology : Yes
Intel VT-x with Extended Page Tables (EPT) : Yes
Intel Virtualization Technology (VT-x) : Yes
Intel Virtualization Technology for Directed I/O (VT-d) : Yes
Intel® AES New Instructions (Intel® AES-NI) : Yes
Intel® Anti-Theft Technology (Intel® AT) : No
Intel® Clear Video HD Technology (Intel® CVT HD) : No
Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID) : No
Intel® Hyper Threading Technology (Intel® HT Technology) : Yes
Intel® InTru™ 3D Technology : No
Intel® Insider™ : No
Intel® My WiFi Technology (Intel® MWT) : No
Intel® OS Guard : Yes
Intel® Quick Sync Video Technology : No
Intel® Secure Key : Yes
Intel® Smart Cache : Yes
Intel® Turbo Boost Technology : 2.0
Intel® Wireless Display (Intel® WiDi) : No
Processor ARK ID : 75257
Compatible operating systems : Microsoft Windows Server, Red Hat Enterprise Linux Server, SUSE Linux Enterprise Server, VMware vSphere Hypervisor
HDD capacity : 1.2 TB
HDD interface : Serial Attached SCSI (SAS)
HDD size : 2.5"
HDD speed : 10000 RPM
Hot-swap : Yes
Maximum storage capacity : 12.8 TB
Number of HDDs installed : 6
Number of SSDs installed : 2
Optical drive type : No
RAID levels : 0, 1, 5
RAID support : Yes
SSD capacity : 400 GB
Total storage capacity : 8 TB
Depth : 804 mm
Height : 173 mm
Width : 482 mm



